Former North Carolina coach Sylvia Hatchell has appealed her guilty plea for killing a woman in a car crash and received a more lenient sentence that will allow her to still drive. Which teams won't be around for long? Which teams are expected to have extended stays in San Antonio? We look at the best and worst case for all The bubble looks different in , with sub-. The ACC, which has had a revolving door on the bubble, might end up with as few as five teams in the NCAA tournament -- or as many as nine.
Courtney Banghart joins the show to talk about how hard the team has been working to work through the rust of not being on the court due to Covid 19 protocols. Louisville's home women's basketball game against North Carolina set for Tuesday night has been postponed. What questions are we looking to get answered when UConn finally makes its season debut on Saturday? Is the ACC the country's deepest conference? Canceled games will challenge schedules all season. But come March, it will still come down to: Who did you play, and who did you beat?
Skip to main content Skip to navigation. You can set both values to be the same server. An optional server name value can be specified to configure Windows Update Agent to download updates from an alternate download server instead of the intranet update service.
If the setting is set to Enabled , the Automatic Updates client connects to the specified intranet Microsoft update service or alternate download server , instead of Windows Update, to search for and download updates. Enabling this setting means that end users in your organization don't have to go through a firewall to get updates, and it gives you the opportunity to test updates after deploying them.
If the setting is set to Disabled or Not Configured , and if Automatic Updates is not disabled by policy or user preference, the Automatic Updates client connects directly to the Windows Update site on the Internet. The alternate download server configures the Windows Update Agent to download files from an alternative download server instead of the intranet update service. The option to download files with missing Urls allows content to be downloaded from the Alternate Download Server when there are no download Urls for files in the update metadata.
This option should only be used when the intranet update service does not provide download Urls in the update metadata for files which are present on the alternate download server. If the "Configure Automatic Updates" policy is disabled, then this policy has no effect.
If the "Alternate Download Server" is not set, it will use the intranet update service by default to download updates. The option to "Download files with no Url Specifies the hours that Windows will use to determine how long to wait before checking for available updates. The exact wait time is determined by using the hours specified here minus zero to twenty percent of the hours specified.
For example, if this policy is used to specify a hour detection frequency, then all clients to which this policy is applied will check for updates anywhere between 16 to 20 hours. If the setting is set to Enabled , Windows will check for available updates at the specified interval. If the setting is set to Disabled or Not Configured , Windows will check for available updates at the default interval of 22 hours. The "Specify intranet Microsoft update service location" setting must be enabled for this policy to have effect.
Any background update scans, downloads and installations will continue to work as configured. Even when Windows Update is configured to receive updates from an intranet update service, it will periodically retrieve information from the public Windows Update service to enable future connections to Windows Update, and other services like Microsoft Update or the Microsoft Store.
When enabled, this policy will disable the functionality described above, and may cause connection to public services such as the Microsoft Store, Windows Update for Business and Delivery Optimization to stop working. This policy applies only when the device is configured to connect to an intranet update service using the "Specify intranet Microsoft update service location" policy.
Specifies the target group name or names that should be used to receive updates from an intranet Microsoft update service.
This allows admins to configure device groups that will receive different updates from sources like WSUS or Configuration Manager. If the setting is set to Enabled , the specified target group information is sent to the intranet Microsoft update service which uses it to determine which updates should be deployed to this computer. If the setting is set to Disabled or Not Configured , no target group information will be sent to the intranet Microsoft update service.
If the intranet Microsoft update service supports multiple target groups, this policy can specify multiple group names separated by semicolons. Otherwise, a single group must be specified. This policy applies only when the intranet Microsoft update service the device is directed to is configured to support client-side targeting. If the "Specify intranet Microsoft update service location" policy is disabled or not configured, this policy has no effect. This policy setting allows you to manage whether Automatic Updates accepts updates signed by entities other than Microsoft when the update is found on an intranet Microsoft update service location.
If you enable this policy setting, Automatic Updates accepts updates received through an intranet Microsoft update service location, as specified by Specify Intranet Microsoft update service location , if they are signed by a certificate found in the "Trusted Publishers" certificate store of the local computer. If you disable or do not configure this policy setting, updates from an intranet Microsoft update service location must be signed by Microsoft. Updates from a service other than an intranet Microsoft update service must always be signed by Microsoft and are not affected by this policy setting.
The base portion of a probe can vary in design to meet the requirements of different applications. For example, in FIG. In one embodiment shown in FIG. Initially, when the tip end of probe was pressured downward, the whole spring of probe reacts with an entire buckling force.
If the downward pressure continues such that stop hits the spring portion of probe , only the top part of the spring portion reacts to the downward pressure. The two stages of buckling reactions produce different combination of vertical and lateral motions at the tip portion of probe The lateral and vertical motions of the tip portion, in turn, produce a scrubbing mark on the device-under-test DUT.
A person of ordinary skill in the art would appreciate that a desired buckling force can be produced by adjusting design factors such as probe height, probe thickness, stop position and stop gap which is the gap or distance between stop and spring portion of probe Additional examples of probe springs include a buckling spring FIG. A scrubbing mark is generally characterized by the length and depth of the mark on the DUT. Referring again to FIG. The contact area has two parallel opposing sides i.
The front scrubbing edge of the contact area may have a sharp, pointed angle suitable for forming a desired scrubbing mark. In one embodiment, the lithographic mold that is used for forming contact tip 45 as in the processes described above with reference to FIGS. Thus, a technique for fabricating a MEMS probe on a substrate has been described.
It is to be understood that the above description is intended to be illustrative, and not restrictive. Many other embodiments will be apparent to those of skill in the art upon reading and understanding the above description. The scope of the invention should, therefore, be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled.
Although the present invention has been described with reference to specific exemplary embodiments, it will be recognized that the invention is not limited to the embodiments described, but can be practiced with modification and alteration within the spirit and scope of the appended claims.
Accordingly, the specification and drawings are to be regarded in an illustrative sense rather than a restrictive sense. All rights reserved. Login Sign up. Search Expert Search Quick Search. MEMS probe fabrication on a reusable substrate for probe card application. United States Patent The probe has a bonding surface to be attached to an application platform of the probe card. The bonding surface is formed on a plane perpendicular to a surface of the substrate. An undercut is formed beneath the probe for detachment of the probe from the substrate.
Click for automatic bibliography generation. Taipei, TW. Download PDF What is claimed is: 1. A method comprising: forming a probe on a substrate using Micro-Electro-Mechanical Systems MEMS processing techniques, the probe having a bonding surface to be attached to an application platform of a probe card, the bonding surface formed on a plane perpendicular to a surface of the substrate; forming an undercut beneath the probe for detachment of the probe from the substrate; detaching the probe from the substrate by breaking a joint located between a base portion of probe and an anchoring structure on the substrate, wherein detaching the probe from the substrate further comprises: forming a sacrificial layer on the substrate; forming the probe and the anchoring structure on the sacrificial layer; and removing the sacrificial layer beneath the probe without completely removing the sacrificial layer beneath the anchoring structure.
The method of claim 1, wherein the anchoring structure has a surface area greater than that of the probe. The method of claim 1, wherein the anchoring structure has a substantially round shape and the probe has a substantially long and narrow shape.
The method of claim 1, wherein the probe comprises: a contact tip to form a contact with a device-under-test, the contact tip sandwiched between two conductive layers of the probe; a probe body, which comprises: a tip portion to support the contact tip; a spring portion; and the base portion to support the tip portion and the spring portion, the base portion having an exposed broken surface that is formed by detaching the probe with force from the substrate.
The method of claim 4, wherein the probe body has thickness variations in its cross sections, the thickness measured in a direction perpendicular to a surface of the substrate.
The method of claim 4, wherein the spring portion has one or more curved shapes and a width that varies along a length of the spring portion, with a first end of the spring portion extending to the tip portion and a second end connecting to the base portion. The method of claim 4, wherein the spring portion includes more than one curved springs connected in parallel.
The method of claim 4, wherein the spring portion provides a buckling force that has two stages with a stop between the two stages. The method of claim 1, wherein the base portion is corrugated. The method of claim 1, wherein the substrate is reusable for fabricating a next batch of probes. A method comprising: forming a probe on a substrate using Micro-Electro-Mechanical Systems MEMS processing techniques, the probe having a bonding surface to be attached to an application platform of a probe card, the bonding surface formed on a plane perpendicular to a surface of the substrate; forming an undercut beneath the probe for detachment of the probe from the substrate; detaching the probe from the substrate by breaking a joint located between a base portion of probe and an anchoring structure on the substrate, wherein detaching the probe from the substrate further comprises: forming a conductive layer on the substrate; forming a sacrificial layer on the conductive layer, the sacrificial layer having an opening to expose the conductive layer; forming the probe and the anchoring structure on the sacrificial layer, the anchoring structure having contact to the conductive layer through the opening; and removing the sacrificial layer beneath the probe.
The method of claim 11, wherein the anchoring structure has a surface area greater than that of the probe. The method of claim 11, wherein the anchoring structure has a substantially round shape and the probe has a substantially long and narrow shape. The method of claim 11, wherein the probe comprises: a contact tip to form a contact with a device-under-test, the contact tip sandwiched between two conductive layers of the probe; a probe body, which comprises: a tip portion to support the contact tip; a spring portion; and the base portion to support the tip portion and the spring portion, the base portion having an exposed broken surface that is formed by detaching the probe with force from the substrate.
The method of claim 14, wherein the probe body has thickness variations in its cross sections, the thickness measured in a direction perpendicular to a surface of the substrate.
The method of claim 14, wherein the spring portion has one or more curved shapes and a width that varies along a length of the spring portion, with a first end of the spring portion extending to the tip portion and a second end connecting to the base portion. The method of claim 14, wherein the spring portion includes more than one curved springs connected in parallel. The method of claim 14, wherein the spring portion provides a buckling force that has two stages with a stop between the two stages.
The method of claim 11, wherein the base portion is corrugated. The method of claim 11, wherein the substrate is reusable for fabricating a next batch of probes. Next Patent Wafer level balanced Placing a MEMS part on an application platform using a guide mask. Probe assembly arrangement.
Approach for fabricating cantilever probes. Method for manufacturing a probe. Lithographically defined microelectronic contact structures.
Method of forming a microelectromechanical MEMS device. System and method of measuring probe float. Electrical test probe and electrical test probe assembly. Two-part microprobes for contacting electronic components and methods for making such probes.
Method of making lithographic contact elements. Spring interconnect structures. Probe assembly. Cantilever microprobes for contacting electronic components and methods for making such probes. Interconnection device for a printed circuit board, a method of manufacturing the same, and an interconnection assembly having the same. Cantilever on cantilever structure. Probe card. Electrical connecting apparatus and contact.
Enhanced compliant probe card systems having improved planarity. Coordinate transforming apparatus for electrical signal connection. Probe interposers and methods of fabricating probe interposers. Probe and method of making same. Process for forming microstructures. Micro contact device comprising the micro contact element and the base member. Contact probe. Spring contact pin for an IC chip tester.
Contact having multiple contact beams. Contact probe, method of manufacturing the contact probe, and device and method for inspection. Method for manufacturing electrical contact element for testing electro device and electrical contact element thereby. Process for forming MEMS.
Interconnect for microelectronic structures with enhanced spring characteristics. Method of making microelectronic spring contact array. Prefabricated and attached interconnect structure.
0コメント